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Multichip Module Market : Revenues to Go Up In The Forthcoming Years (SARS-CoV-2, Covid-19 Analysis)

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Multichip Module Market : Revenues to Go Up In The Forthcoming Years (SARS-CoV-2, Covid-19 Analysis)

Multichip Module Market

The sudden challenges created by the ongoing COVID-19 are captured effectively to exhibit the long term growth projections in the MRFR report on Multichip Module Market. The growth sectors of the Multichip Module Market are identified with precision for a better growth perspective.

The electronics industry is continuously innovating with the objective of developing smaller but efficient electronic products. Multi-chip module is one of the key innovations in the area of chip packaging where multiple ICs are incorporated into a single device. The advantages offered by a multi-chip module are short distance between ICs that help in improving performance of the device while managing its size and weight, lower power supply requirement, greater miniaturization, and lower cost. Multi-chip module has diverse application areas, such as RF wireless modules, portable electronics, servers, power amplifiers, LED packages, wearable computers, and high-power communication devices. Moreover, manufacturing of the product can be customized to meet the diverse requirement of various end-users. However, lack of technical expertise and continuous innovation in the chip manufacturing processes, resulting into development of alternate products act as major restraining factors for the growth of the multi-chip module market.

In this study, the multi-chip module market is segmented based on type, industry vertical, and regions/country. By type, the market is segmented into NAND-based MCP, NOR-based MCP, eMCP, and uMCP. By industry vertical, the market is segmented into consumer electronics, automotive, medical devices, aerospace and defense, and others. Finally, the regions covered in this study are North America, Europe, Asia-Pacific, and the rest of the world. North America is further segmented into the US, Canada, and Mexico; Europe into Germany, France, the UK, and the rest of Europe; and Asia-Pacific into China, India, Japan, and the rest of Asia-Pacific.

In the type segment, NAND-based MCP is expected to be the largest contributor. The uMCP segment is expected to grow with the highest CAGR during the forecast period, 2018-2023, due to the greater efficiency offered by the type of product than other types of multi-chip module.

Among the industry verticals, consumer electronics is expected to be the largest contributor while automotive is expected to grow with the highest CAGR from 2018 to 2023. The reason for fastest growth of the automotive industry vertical can be attributed to the growing connected car and vehicle infotainment systems market.

Key players: 

The prominent players in multi-chip module market are SK HYNIX INC. (South Korea), Palomar Technologies (US), Infineon Technologies (US), Samsung Electronics (South Korea), STMicroelectronics (Switzerland), Micross (US), Cypress Semiconductor (US), Macronix International Co., Ltd. (Taiwan), TEKTRONIX, INC. (US), and Texas Instruments (US).

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About Market Research Future:
At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Reports (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research and Consulting Services.
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Email: [email protected]

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