Market Research Future (MRFR) in the new report on the global Electronic Packaging market 2020, states determiners and restrains on the market. The Electronic Packaging Market is estimated to attain an income worth USD 2254.49 Million by 2025 by registering a CAGR of 16.10% in the impending period.
The increasing demand for customer electronics is estimated to play a vital role in the development of the electronic packaging market share in the forecast period. Moreover, the steadily rising demand for smartphones is estimated to spur the electronic packaging market in the approaching period.
Competitive Analysis
The restoration and everyday operations are estimated to take some time, which will lead to intensive development of backlog in delivery. The financial assistance provided by the government around the world and trade bodies is estimated to salvage the situation in the coming years. The downturn effects visible in the market are estimated to stay a little longer due to the scale of impact on the global market. The need for prudent analysis of the market trends and demand projections is estimated to lead to formidable development in the market.
Top Companies profiled in Electronic Packaging Market Research Report:
Xilinx Inc. (US), Dordan Manufacturing Company (US), GY Packaging, (US), Plastiform Inc. (US), Kiva Container Corporation (US), Samsung Electronics Corporation Ltd (South Korean), The Box Co-Op (US), Quality Foam Packaging Inc. (US), Sealed Air Corporation (US), DuPont de Nemours, Inc. (the US), UFP Technologies, Inc. (US), AMETEK Inc. (US), Intel Corporation (US), STMicroelectronics NV (Switzerland), AMS AG (Austria), Primex Design & Fabrication (US), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan), among others.
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Segmental Analysis
Segmentation
The Global Electronic Packaging Market has been segmented based on Material, Packaging Technology, End-User, and Region.
- By Material, the market has been segmented into plastic, metal, glass, and others.
- By Packaging Technology, the market has been segmented into the through-hole mounting, surface surface-mount technology (SMD), and chip-scale packages (CSP).
- By End User, the market has been segmented into consumer electronics, aerospace & defense, automotive, telecommunication, and others.
- By Region, the market has been segmented into North America, Europe, Asia-Pacific, and the rest of the world.
Detailed Regional Analysis
The regional evaluation of the electronic packaging market is segmented into regions such as Asia-Pacific, North America, Europe, and the rest of the regions in the world. The Asia-Pacific region controlled the electronic packaging market in the year 2018 and is anticipated to direct the market’s development in the forecast period.
Major Highlights of TOC Covers:
- Executive Summary
- Key Business Trends
- Regional Trends and Growth
- Product Trends
- End-use Trends
- Definition and Forecast Parameters
- Electronic Packaging Market Segmentation
- Electronic Packaging Market Landscape
- Vendor Matrix
- Company Profiles
- Business Overview
- Financial Data
- Product Landscape
More…
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