It's a billion-dollar question: Should we care that there's a GH59-09418A printed circuit board inside a Samsung smartphone?At US District Court in San Jose, California, the heart of Silicon Valley, Apple and Samsung are trying to persuade a jury to see smartphones in very different ways.An earlier trial in the seven-year case already determined that Samsung infringed three Apple design patents, which cover ornamental elements of a product, and two functional patents, which govern how a product works.Also at stake is whether design patents, which govern ornamental aspects of products, are powerful tools that can keep competitors at bay, or tools that're relatively limited in influence.Co-founder and former Chief Executive Steve Jobs vowed a duel to the death over what he saw as iPhone copying in phones powered by Google's Android operating system.Repeat after me: Article of manufacture
It's a billion-dollar question: should we care that there is a GH59-09418A printed circuit board inside a Samsung smartphone?At US District Court in San Jose, the heart of Silicon Valley, Apple and Samsung are trying to persuade a jury to see smartphones in very different ways.An earlier trial in the seven-year case already determined that Samsung infringed three Apple design patents, which cover ornamental elements of a product, and two functional patents, which govern how a product works.But the damages payment that a jury now will set depends on just how important the GH59-09418A and thousands of other tidbits are in a phone.Also at stake is whether design patents, which govern ornamental aspects of products, are powerful tools that can keep competitors at bay or relatively limited in influence.Apple -- where good design is job one, company executives testified Tuesday -- is pushing for power.
LG is reportedly going to start using Substrate-like printed circuit board (SLP) in its devices next year.SLP allows device makers to fit more components onto a smaller motherboard.A smaller motherboard means device makers can increase the size of the phone’s battery, crucial as they move towards 5G devices.LG is reportedly going to use Substrate-like printed circuit board (SLP) in some of its devices next year.This would allow for a smaller motherboard inside the phone, meaning the device could fit in the same amount of components while taking up less space.Etnews reports that LG will start using SLP by the first half of next year, so it could be used on the potential LG G8 in 2019.
A new technology introduced by Taiwan Semiconductor Manufacturing Company (TSMC) could boost the power of graphics cards by Nvidia and AMD without making them physically larger.The technology is called wafer-on-wafer, and mimics 3D NAND memory technology used in modern solid-state drives by stacking layers vertically rather than spreading the hardware horizontally across the printed circuit board, which would require additional physical space.Unlike your favorite snack, it’s a thin slice of polished semiconductor material that serves as the foundation for a crisscross of layered copper wires that convey electricity, and the transistors that are the heart of the processor.The wafer and mounted components are cut by a diamond saw into single chips and placed into the physical processor package you see when you break open the desktop.Right now, graphics chips produced by Nvidia and AMD rely on a single wafer.But TSMC, the largest dedicated independent semiconductor foundry on the planet, discovered a way to stack two wafers in a single package.
Xiaomi has announced that it will be increasing the suggested price of the 4GB+64GB Redmi Note 5 Pro, in a bid to ensure “steady supply” of the devices.The company has opened several manufacturing facilities in India, including a plant devoted to printed circuit board assemblies (PCBAs) earlier this month.Unfortunately, the PCBA plant will only meet the required increase in production from Q3 2018, forcing the Chinese brand to import more PCBAs, it claimed.“With the recent changes in tax structure on PCBA imports and the depreciation of the rupee… this has resulted in a significant increase in costs for us,” the company wrote on its website.“To ensure the steady supply of Redmi Note 5 Pro, we are marginally increasing the price of Redmi Note 5 Pro 4GB + 64GB variant by 1,000 rupees to partly cover the above costs.”This, of course, means the phone will be retailing for 14,999 rupees (~$225) instead of 13,999 rupees (~$210).
The trade war is onThe US government on Tuesday revealed the list of Chinese imports it plans to slap extra tariffs on, under orders from President Trump, amid rising trade tensions between America and China.The much-awaited list [PDF] includes metal alloys, electronic parts, and industrial machinery.The catalog was published by the Office of the United States Trade Representative (USTR), and covers approximately 1,300 products.These devices face up to 25 per cent extra import duties, when shipped from Chinese factories into America, and those bonus costs will have to be borne by someone along the line.Hard drives to networking gizmos
Reports have emerged that Nintendo is working on new and improved Switch hardware.Though the console’s recent 5.0 firmware update wasn’t up to much on the surface, hackers on Switchbrew (via Resetera) have been digging into to the upgrade and found evidence which suggests a hardware refresh is in the works.Switchbrew discovered references to a new T214 chip (which would be a small improvement on the current T210) as well as an updated printed circuit board and 8GB of RAM instead of the current 4GB.While the upgraded chip could simply be in response to some hardware security problems that emerged when hackers started bringing homebrew software to the console, the new PCB and increased RAM suggest a more powerful model.This report is interesting in the context of a report from the Wall Street Journal earlier this month, which stated that Nintendo had no plans to make any hardware updates this year and would instead be focusing on peripherals, like Nintendo Labo, to extend the console’s lifespan.If Nintendo is not planning a hardware upgrade this year, then, it could be looking to introduce one in the future if the information uncovered from these files is accurate.
Reports have it that Apple plans to develop a foldable smartphone in response to the Samsung Galaxy X speculations.For this, Apple has partnered with LG to develop the first iPhone with a foldable display.LG Innotek has been given the task to develop a flexible printed circuit board while LG Display takes care of the foldable display.This subsidiary of LG Corporation has applied for a patent for a foldable display that was published today in the WIPO database.LG Display filed for the patent and it concerns a display device that supports a collapsible part of a flexible display.This patent was filed on the 29th of March 2017 but was only published today.
Singapore-based startup KaHa – also known as CoveIoT – has raised US$4.5 million in funding from investors, including SPRING Seeds Capital and Titan.KaHa designs and builds wearables such as smartwatches and fitness trackers.It provides manufacturing services such as electronics design and printed circuit board assembly, as well as app development, cloud storage, data analytics, and after-sales services.Its “internet of things” (IoT) platforms – its Cove and Covenet brands – enable connectivity between these wearables and other consumer tech devices, allowing third parties such as watchmakers and sports equipment manufacturers to incorporate smart wearable technology into their existing product offerings.KaHa CEO Pawan Gandhi claims this “white-label,” platform-based approach is what separates the startup from the substantial number of companies working in the wearables space, including big-name players such as Apple and Xiaomi.“As an enterprise, we are unique in that we provide complete end-to-end solutions to our brand partners,” he said in a statement.
Thu, 7 Dec 2017 - 14:00 ET / 11:00 PT / 19:00 GMTIf you want to learn about designing high-speed interconnects for 5G and Satcom applications, tune into this webinar with guest speaker Eric Gebhard of Signal Microwave.Connector implementation is often the last part of a design that an engineer thinks of when developing and testing new digital and RF products for 5G and Satcom applications, yet it can greatly affect the performance of a design.One of the keys to avoiding this issue is to properly design the interface between the printed circuit board and the connector, known as the board launch.Connectors and how they interact with the board launch can determine the success or failure of a design.If the signal entering or leaving the board launch through the connector is compromised, then the performance of the entire design is affected.
What makes Google’s Pixel 2 XL squeezable?The techs over at iFixit wanted to know that.Plus, they are continually curious to find out just how fixable a phone is for home repairs.So they did what they always do – they tore it apart.Before the team at iFixit got to the systematic dismantling of the Pixel 2 XL, they took an X-ray of it and theorized that the dark rows of rectangles on either side of the screen were the squeeze sensors.“The sensor consists of a flexible printed circuit board wrapped around both sides of a line of steel chunks, with strain gauges bridging the gaps between the metal bits.”
Women will take a major step forward in the electronic music industry thanks to pioneering projects underway at Lancaster University.Women are conspicuous by their absence in the sound industry fields of live coding, sound engineering, instruments and history, according to Project Director Dr Linda O'Keeffe, a Lancaster University lecturer and founder of WISWOS (Women in Sound Women on Sound), an international organisation set up to redress the gender balance."It's vital we demonstrate that this is not a field that belongs to one gender," explains Dr O'Keeffe.Her approach has been both practical and theory orientated focusing on: encouraging more music technology teaching in schools and building a global awareness.The creation of a brand new 'Research in a Box' teaching resource, funded by Lancaster University, is all set for distribution to schools at the start of the autumn term.The box includes a stepped tone generator, components to build a printed circuit board, a soldering iron, engaging tutorial CDs and videos led by Dr O'Keeffe, an instruction manual and a copy of 'Pink Noises', the must-have book by Tara Rodgers for women who want to be serious in sound.
We’ve seen many iPhone leaks over the weekend, including reports on both the iPhone 7s and iPhone 8 models that Apple is expected to launch later this year.A series of schematics leaked from Foxconn seems to confirm previous reports that detailed the internal design of the iPhone 8, including some of the handset’s novel features.Published initially on Weibo, these schematics apparently show the internal layout of the iPhone 8.Features like the vertical dual camera setup, the smaller printed circuit board, the L-shaped battery, and the wireless charging coil are all pretty clear in these pictures.The front-facing camera assembly that’s going to be responsible for the iPhone 8’s top bezel is also seen in these schematics.These features were shown off in previous iPhone 8 schematics leaks and were mentioned in various other iPhone rumors.
the Korea Herald reports that a supplier to Apple would be manufacturing the flexible printed circuit board of an advanced type for the upcoming Iphone 8 has pulled out.It leaves the two remaining manufacturers of the circuit boards in the lurch, and according to the newspaper, Apple has chosen to rent and to buy the machines used in the manufacturing process in order to ensure availability.the circuit Boards are of the type rfpcb and should be used in skärmpanelerna in the new phone.They are more expensive and more svårtillverkade than the usual printed circuit board, and the company pulled out of the should have complained on Apple's high quality requirements and the low the profit margin.it is Now expected that Interflex and Youngpoong Electronics share of the approximately 100 million devices that Apple will need in the years to come.
Apple recently bought ‘tens of millions’ of dollars worth of production equipment for the iPhone 8, according to tipsters, and it is leasing that equipment to its suppliers in an effort to make sure vital components are correctly made.This equipment is reportedly necessary for making a rigid flexible printed circuit board that connects the phone’s components with its various chips.The information comes from insiders speaking to Korean publication The Investor; they say Apple doesn’t have plans to use this equipment itself, but rather to make it available to suppliers.This wasn’t the original plan, though, per these sources — they claim Apple originally intended to source boards from a trio of suppliers, one of which backed out of the deal.Which supplier left isn’t clear, with the source stating only that it is a Taiwanese manufacturer; the reason for the departure also isn’t stated.However, the part reportedly remains vital for the fabled OLED version of the iPhone.
The agents hold down the commander and cut through the skin of his upper arm, pulling out a slim, transparent circuit board containing the unit’s military directives.But as soon as the agents remove the device, it dissolves before their eyes.Yet such technology is one step closer to reality this month, thanks to a proof-of-concept study published in the journal ACS Applied Materials and Resources.A pair of engineers at Vanderbilt University has constructed simple circuit boards, including conductive traces and capacitors, that work above room temperature but rapidly disintegrate when cooled below 32 C (89 F).The novelty of this new technology is that simple neglect leads to destruction: When warm, the technology works; if not, it comes apart.“You have to provide heat to prevent it from dissolving.”
Dissolving circuit boards could be used in the military, or in more conventional use-cases like hospitals, too.The idea of a circuit board that dissolves the moment it’s cooled totally sounds like something out of the Mission: Impossible movies, or maybe a mystery heist flick where a rare computer disappears after being removed from its air-conditioned safe.In fact, it sums up the work being done by researchers at Vanderbilt University, described in a new paper published in the journal ACS Applied Materials & Interfaces.What they’ve been working on is a way of building transient electronics that come apart when you stop heating them.“What we have done is produce a composite system that behaves like a regular circuit board when immersed in warm water, but if the water cools below a threshold temperature, the entire system disintegrates, dissolves, and stops working,” Dr. Leon Bellan, assistant professor of mechanical and biomedical engineering at Vanderbilt, told Digital Trends.“We have achieved this behavior by coupling two separate materials: networks of silver nanowires, and a polymer that exhibits the odd behavior of being insoluble in warm water, but soluble in cold water.”
A Lithuanian company called Neurotechnology has developed a device they are calling an ultrasonic 3D printer.Built by the firm’s Ultrasound Research Group, it is just a prototype at this stage and is only capable of assembling printed circuit board (PCB) electronics.In fact, it is less 3D printer and more assembler, but the researchers believe the technology is capable of fabricating anything you can think of just from raw materials.Each transducer is individually controlled by a computer and can create “pressure profiles” capable of moving and rotating objects within the array.The printer can move water, molten plastic or metal without touching the material.If the device can manipulate melted plastic precisely, it could theoretically form it into a template for something like a smartphone casing.
One of the Nintendo Switch's biggest issues is about to get fixed—by Nyko, of all companies.It's basically the Switch Dock, only a lot smaller—maybe a tad smaller than a deck of cards.Nyko announced this Nintendo Switch accessory during E3, but I wanted to be sure it was worth recommending, so I stopped by the company's E3 booth and demanded to see it in action.Finally, a dock for a messenger bagNintendo's official Switch Dock includes a custom circuit board that regulates power, adds additional USB port support, and enables HDMI-out capabilities.I wanted very much to take my Switch and maybe, just maybe, plug it into TVs at bars or other friends' houses.
Announced back in April, Galax's GTX 1070 Katana caught our attention for counting itself among the few single-slot gaming graphics cards available today.In fact, to the best of our knowledge, this is the only single-slot, air-cooled GTX 1070 in the world, as anything with a thermal design power of 75 watts or higher is typically paired with a dual-slot cooler for the added heat dissipation.There's no doubt that this is a niche product, but it should call to compact system builders who would rather not sacrifice an additional expansion slot, which could otherwise be used for hardware such as a dedicated sound card, an NVMe SSD, a Thunderbolt 3 controller, or extra SATA ports.This card may also become a popular choice for those building workstations with multiple high-end graphics cards because you only need a single slot between the cards for SLI support rather than the typical two slot spacing, which is to say that pair of Katana cards should deliver better operating temperatures than bigger dual-slot cards on boards such as the Asus ROG Strix Z270G Gaming or Asrock Z270M Extreme 4, for example.Covering the entire front side is a pancake-like aluminium fan shroud which has been painted gunmetal grey.What we found was a 4+1 VRM which is the same configuration used by Nvidia's Founders Edition model, though the VRM has switched sides and is now placed behind the display outputs.