As per a study by Fact.MR, the global organic substrate market is anticipated to witness steady growth from 2017 to 2026.
Also, OLED made of single layer of organic material is moving towards using multiple layers to increase effectiveness and efficiency.Request Free Sample Report Here:https://www.factmr.com/connectus/sample?flag=S_id=360Considering the broad scope of the global organic substrate market, the report by Fact.MR provides an in-depth analysis and segment-wise analysis along with the forecast.
Tape substrate is estimated to bring in nearly US$ 9,200 million revenue by the end of 2026.Compared to the rigid substrate, tape substrate is likely to gain the highest revenue share between 2017 and 2026.
Tape substrate is projected to account for more than half of the revenue share by 2017 end and also likely to surpass US$ 9,100 million revenue.
By 2026 end, small outline packages (SOP) are projected to surpass US$ 4,400 million revenue.
There has been an increasing demand for fine integrated circuit packages as these small outline packages minimize total volume consumed by memory components.
As per a study by Fact.MR, the global organic substrate market is anticipated to witness steady growth from 2017 to 2026.
Also, OLED made of single layer of organic material is moving towards using multiple layers to increase effectiveness and efficiency.Request Free Sample Report Here:https://www.factmr.com/connectus/sample?flag=S_id=360Considering the broad scope of the global organic substrate market, the report by Fact.MR provides an in-depth analysis and segment-wise analysis along with the forecast.
Tape substrate is estimated to bring in nearly US$ 9,200 million revenue by the end of 2026.Compared to the rigid substrate, tape substrate is likely to gain the highest revenue share between 2017 and 2026.
Tape substrate is projected to account for more than half of the revenue share by 2017 end and also likely to surpass US$ 9,100 million revenue.
By 2026 end, small outline packages (SOP) are projected to surpass US$ 4,400 million revenue.
There has been an increasing demand for fine integrated circuit packages as these small outline packages minimize total volume consumed by memory components.