Making smartphones is hard business, especially if you’re not a giant like Samsung or even someone smaller like Motorola.It becomes even more difficult when you’re using a combination of hardware and software that no other company uses, specifically those geared towards open source solutions and privacy.With that in mind, it’s not hard to imagine that Purism would run into issues even as the first batches of its Linux-powered privacy-focused Librem 5 phone.That’s exactly what happened but the small company is confident it can course-correct after just one slight delay.Purism’s announced schedule of shipping its crowdfunded phones in batches sounded both unorthodox and almost unfair.It has, however, proven to be strategic as it is allowing Purism to learn about bugs and fix them quickly before making all the devices in one batch and sending them all.
AMD may introduce its new Ryzen Threadripper HEDT chips on November 5, with the 3960X and 3970X seeing sales info and review embargoes lifted on November 19, and AMD merely teasing its 3990X processor next month, providing only the name and core count.All this AMD news arrives by way of leaked documents acquired by Videocardz.These documents also mention a new TRX40 chipset, along with a list of motherboard manufacturers slated to showcase TRX40-based products during the reveal.These motherboards won’t go on sale until November 19.AMD announced in September that the “initial members” of its third-generation Ryzen Threadripper processor family would arrive in volume during November but didn’t provide a solid date.Real or not, the listing reports a 24-core, 48-thread chip based on AMD’s third-generation Zen 2 design.
Today, Xiaomi officially unleashed the Redmi 8/8A smartphones in China.Also, it disclosed some noteworthy information concerning the upcoming Redmi K30 flagship smartphone and the new RedmiBook with AMD.It turns out the Redmi K30 will support dual-mode 5G and will come with two holes on the screen.Thus, instead of the single-hole display design adopted by the major manufacturers, the new Redmi flagship will sport two front cameras.What’s more interesting, the RedmiBook with AMD Athlon processor is on its way.It will hit the market as soon as on October 21.
Over the last couple weeks, we heard word of an AMD Ryzen 9 3900 hitting the street, and now it seems like those rumors were accurate – mostly.AMD just announced a new lineup of PRO processors, led by the AMD Ryzen 9 PRO 3900.This processor's TDP (Thermal Design Power) is lowered to 65W from the Ryzen 9 3900X's 95W, which should mean it'll emit less heat and consume less power.There's a whole world of PC components out thereThe AMD Ryzen 9 PRO 3900 is accompanied by the Ryzen 7 PRO 3700 and Ryzen 5 PRO 3600, along with a bunch of G-series Ryzen processors with Radeon Vega graphics.It should be noted, that because these are all 65W parts, you shouldn't expect boost clocks to be as high – the Ryzen 9 PRO 3900 only reaches up to 4.3GHz, compared to the Ryzen 9 3900X's 4.6GHz.
As we’re gearing up for the launch of the Intel Core i9-9900KS – with some motherboard manufacturers already releasing motherboard firmware to support the new processor – new documentations surface to suggest that the more powerful iteration of Intel Core i9-9900K could potentially hit the streets with a 127W TDP (thermal design power).Sharp-eyed Redditor Urotho noticed that Asus has updated the processor support list for its ROG Maximus XI Code gaming motherboard, listing the Core i9-9900KS with a 127W TDP.Of course, this specification has not been confirmed by Intel.Additionally, it looks like Asus has since taken the Core i9-9900KS off the motherboard’s CPU support list, perhaps until the chip hits the streets in October.However, Tom’s Hardware also pointed out that Russian retailer DNS Shop corroborates this information on its Core i9-9900KS landing page.What this higher TDP means to consumers?
Intel recently made a huge splash with the release of its Comet Lake processors for laptops and tablets, but that doesn’t mean it’s done.Hong Kong-based website, XFastest, recently shared three leaked slides from an anonymous source showing an Intel Core platform boasting a new Intel 400 series chipset and an LGA 1200 socket.To top that off, these slides also include a roadmap indicating that the 10-core Comet Lake CPUs for desktop computers are slated to roll out in the first quarter of 2020.Based on the slides, this new chipset looks to be designed to support up to 10-core and 20-thread processors.The platform details also suggest that the enthusiast level TDP is seeing a bump of up to 125W from the previous 95W for enhanced core & memory overclocking.According to ExtremeTech, Intel might be trying to avoid cutting the base clock speed as it did when moving from the 8th to 9th generations as well.
These include U- and Y-series Intel Comet Lake processors for laptops and 2-in-1 tablets.Aside from the main upgrades, like increased performance, the hardware also comes with support for a number of extra features, such as modern networking capabilities and improved graphics.Front and center in the announcement is Intel's powerful new U-Series mobile processors in the Comet Lake family.These are still built on a 14-nanometer (nm) process – as opposed to Intel's other 10-Generation mobile processor family, Ice Lake – but Intel is setting them up to deliver increased performance while maintaining battery-friendly power budgets.The new chips have a thermal design power (TDP) threshold of 7 watts (W) and 15W, though device makers can use the CPUs configured up to 25W.The new, 10th-Gen Intel Core mobile processors will boast up to six cores and 12 threads, up to 12MB of low-latency cache, and max boost frequencies up to 4.9GHz.
Today, Intel is launching a new series of 14nm notebook CPUs code-named Comet Lake.The interesting question—and one largely left unanswered by Intel—is why the company has decided to launch a new line of 14nm notebook CPUs less than a month after launching Ice Lake, its first 10nm notebook CPUs.This adds up to a total of 19 Intel notebook CPU models released in August, and we expect to see a lot of follow-on confusion.During the briefing call, Intel executives did not want to respond to questions about differentiation between the Comet Lake and Ice Lake lines based on either performance or price, but the technical specs lead us to believe that Ice Lake is likely the far more attractive product line for most users.Both lines also support a "Config Up" 25W TDP, which can be enabled by OEMs who choose to provide the cooling and battery resources necessary to support it.This sharply limits the appeal of the Comet Lake i7 CPUs in any OEM design that doesn't include a separate Nvidia or Radeon GPU—which would in turn bump the real-world power consumption and heat generation of such a system significantly.
AMD is riding high at the moment, and it seems the company isn’t planning to take its foot off the gas, as a recently-published EEC (Eurasian Economic Commission) listing has seemingly outed a new range of third-generation Ryzen desktop processors.According to the listing, AMD could be working on unannounced Ryzen 3000-series processors, including the Ryzen 9 3900, Ryzen 7 3700 and Ryzen 5 3500.AMD’s current family of Ryzen 3000 processors range from the midrange AMD Ryzen 5 3600 to the high-end 16-core Ryzen 9 3950X, and have been highly acclaimed by both critics and consumers.It makes sense that AMD would like to keep this momentum going by introducing new processor models at more appealing prices.If these processors exist – and aren’t just placeholders – then they would potentially be variants of existing processors with lower TDP (thermal design power), which means they could have lower clock speeds (and lower prices).So, the AMD Ryzen 9 3900 would be a lower-powered version of the excellent AMD Ryzen 9 3900X, with a similar relationship between the Ryzen 7 3700 and the Ryzen 7 3700X.
Consumers curious to know how Intel’s upcoming 10th-generation processors will stack up against AMD’s lineup are now getting their first snapshot, as benchmarks for an i7 model have leaked showing an edge over AMD’s Ryzen 9 3900X.The test, performed using Geekbench benchmarking tools on an HP Spectre x360 laptop, confirms that the i7-1065G7 CPU from Intel’s next generation of chips (known by the Ice Lake moniker) outperforms the Ryzen 9 3900X in single-core performance.Although the Ryzen 9 3900X still enjoys a clear lead in multi-core processing, this is still quite a feat for the Ice Lake i7, and a huge vote of confidence for Intel.The results are that much more impressive considering that the nimble Ice Lake mobile chip can put out a higher single-core score despite the fact that it runs at less than half the base clock speed, and less than 20% of the thermal design power (TDP) wattage, of the beefier AMD Ryzen 9 desktop chip.For Intel, this does more than merely deflate the boastful performance claims of their competitor’s powerhouse CPU.The leaked test scores more immediately stand as a compelling answer to the criticism surrounding Intel’s decision to push back a die-size shrink to 7nm until 2021.
Although Intel is often criticized for failing to scale its chips down to ARM’s level of energy efficiency, it still has the edge when it comes to raw processing power when TDP is not much of an issue.That’s especially applicable in research fields where the main concern is, to some extent, trying to make computers replicate how the human brain works.It’s for that exact purpose that Intel has developed its Loihi “neuromorphic” research chip that it has now put on a specialized system to provide the processing needs of special applications ranging from research to AI to IoT.To some extent, Intel is taking a shot at its rivals in the silicon market, especially those that are gearing their chips towards AI and machine learning applications.Almost all of these, including Intel itself, simply reuse the same chips and computing architectures from normal consumer computing and apply them for such purposes.Intel, however, is saying that for specialized uses, you will need specialized architectures as well.
Thermal throttling is a fact of life for smartphones.SoCs generate a lot of heat, and when this heat can't be dissipated, processors react by slowing down and thereby generating less heat.Usually this is just an issue for heavy 3D gaming sessions or a phone directly exposed to sunlight for a long time, like when mounted on a car windshield.While the vast majority of people don't yet have access to a 5G phone or 5G service, PCMag's Sascha Segan has been flying around the country testing out the carriers' nascent implementation of 5G.On a hot Las Vegas morning, my two Galaxy S10 5G phones kept overheating and dropping to 4G.This behavior is happening with all of the millimeter-wave, first-generation, Qualcomm X50-based phones when temperatures hit or exceed 85 degrees.
During the presentation, AMD unveiled news about its chips and graphics processors that will increase pressure on competitors Intel and Nvidia, both in terms of pricing and performance.All new third-generation Ryzen CPUs, the first with 7-nanometer desktop chips, will go on sale on July 7.The showstopper of Su’s keynote was the announcement of AMD’s 12-core, 24-thread Ryzen 9 3900x chip, the flagship of its third-generation Ryzen family.It will retail starting at $499, half the price of Intel’s competing Core i9 9920X chipset, which is priced at $1,189 and up.The 3900x has 4.6 Ghz boost speed and 70 MB of total cache and uses 105 watts of thermal design power (versus the i9 9920x’s 165 watts), making it more efficient.AMD says that in a Blender demo against Intel i9-9920x, the 3900x finished about 18 percent more quickly.
It's been just over a year since Intel's 8th-generation Coffee Lake processors (CPU) got low-powered T-Series variants.Now, with the Coffee Lake Refresh in full swing, it makes sense to expect low-power versions.It appears that may be exactly what is coming, according to leaks compiled by Hexus.A series of leaks detailed the names, specs and thermal design power (TDP) levels of various T-Series processors.An important aspect for low-power builds is that TDP, which all of the new T-Series processors appear to share at a low 35W.This is identical to what the 8th-gen T-Series processors offered, allowing for smaller desktop builds with lower-wattage power supplies and less robust cooling.
AMD's Ryzen mobile processors follow in the wake of the desktop-class processors (CPUs), with commercial-grade Ryzen Pro mobile processors following.That trend continues into Ryzen's second generation, as AMD has officially unveiled its 2nd Gen Ryzen Pro mobile processors in a press release.AMD Ryzen 7 PRO 3700U – 4C/8T, 2.3GHz (4.0GHz boost); Radeon Vega 10 graphics; 15W TDPAMD Ryzen 5 PRO 3500U – 4C/8T, 2.1GHz (3.7GHz boost); Radeon Vega 8 graphics; 15W TDPAMD Ryzen 3 PRO 3300U – 4C/4T, 2.1GHz (3.5GHz boost); Radeon Vega 6 graphics; 15W TDPAMD Athlon PRO 300U – 2C/4T, 2.4GHz (3.3GHz boost); Radeon Vega 3 graphics; 15W TDP
Huawei has big plans for 2019.Before we dive deep into whether that could happen, and other projections for the year to come, let’s take a step back and talk about Huawei’s most memorable moments of 2018 — the good, the bad, and the ugly.The latest EMUI 9.0 is much more simplified than previous versions of the Android skin and has many new features on board.The Chinese giant managed to stay in second place in Q3 as well, with sales reaching 52 million units, according to Counterpoint.It does this by ignoring things like thermal design power (TPD) recommendations, which results in a very high benchmark score that wouldn’t work long term in real-world situations.Huawei’s major problem began in early 2018 when rumors started going around that the company will expand its presence in the U.S with a deal struck with AT However, things quickly went south — AT decided to back out of the deal at the last minute, reportedly due to “political pressure.” Apparently, there were concerns Huawei’s alleged ties to the Chinese government could make the company a security threat.
AMD has made two new processors to counter Intel’s Coffee Lake H series chips, which are often found in gaming notebooks and mobile workstations.While these are largely just laptop versions of the desktop-class four-core processors that AMD already launched this year, the new chips could mark AMD’s expansion into more notebooks and mobile workstations.The new AMD Ryzen 5 2600H and Ryzen 7 2800H are 45-watt processors with four CPU cores, eight processor threads, and Radeon Vega graphics.The new chips support DDR4 RAM up to 3200 MHz, which is decent compared to others on the market.Both 14nm chips can be configured to 35 watts of thermal design power or up to 54 watts, so laptop makers can choose a higher setting for better performance or a lower setting for less heat and extended battery.Both chips are fairly similar, but the Ryzen 7 2800H is slightly higher-specced than the Ryzen 5 2600H, with a 3.3GHz baseline speed and 3.8GHz boost speeds if needed, along with integrated 1.3GHz Radeon Vega 11 graphics.
AMD has revealed a slate of new processors aimed at both consumer and commercial customers, including the dual-core AMD Athlon 200GE.This processor, which AMD terms “reimagined” comes with two cores, four threads and a processor frequency of 3.2GHz.It also features integrated Radeon Vega 3 graphics, and is based on AMD’s x86 Zen architecture.According to AMD, the Athlon 200GE offers 67% more graphics performance, twice the power efficiency and 84% faster high-definition PC gaming that its competition.AMD didn’t specify the competition, but we’d wager it was a similar dual-core chip from Intel, perhaps the Intel Core i3-8109U.The AMD Athlon 200GE has a thermal design power of 35W, making it a good choice for small form factor and low-power PCs, and will cost $55 (around £40, AU$80), which is a very tempting price.
They run so hot, in fact, that the very fancy 8th Gen Intel Core processors inside them were throttled down to below their base speed.Apple has acknowledged that thermal throttling is a real issue caused by a software bug, and it’s issuing a software update today that is designed to address it.The company also apologized, writing, “We apologize to any customer who has experienced less than optimal performance on their new systems.”Apple claims that it discovered the issue after further testing in the wake of Lee’s video, which showed results that Apple hasn’t seen in its own testing.The bug affects every new generation of the MacBook Pro, including both the 13-inch and 15-inch sizes and all of the Intel processor configurations.It does not affect previous generations.
Apple came out swinging when it announced its latest MacBook Pro update earlier this month.In preparation for the launch, the company seeded souped up versions of the notebook with a diverse array of creative professionals, who happily discussed the ways in which the new specs have improved their workflows.The laptop performed admirably and racked up some impressive benchmark scores in our testing that were in line with the performance boosts recorded by Geekbench itself.But in amongst those reviews, Dave “D2D” Lee reported some troubling findings in a video titled “Beware the Core i9.”The YouTuber found that exporting video with Premier Pro actually took longer on the new models sporting a top of the line Core i9 than they did on last year’s model running an i7.Counterintuitive to say the least — and something that appeared to be some sort of system throttling, in order to deal with overheating while exporting.
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