The global Flip Chip Market Size is growing rapidly. Factors such as rapidly growing end-use industries and the vast consumption of flip-chips in consumer electronics and devices in medical, telecom, and automotive systems drive the market growth. Furthermore, increasing sales of medical devices boost the Flip Chip Technology market size.
With improvements in 4G and 5G networks and the global economy, the market is projected to witness rapid traction over the next few years. According to Market Research Future (MRFR), the Flip Chip Technology market is expected to grow at an impressive CAGR throughout the review period (2020-2027).
Additionally, vast advancements in electronics industries and Flip Chip Technology worldwide have been influencing the market value. Conversely, the high production cost of these chips is a major factor impeding market growth. Nevertheless, the rapidly growing CMOS image sensor market would support the market growth throughout the forecast period.
Flip Chip Technology Market – Segments
The report is segmented into products, packaging technology, wafer bumping procedures, packaging types, applications, and regions. The product segment is sub-segmented into CMOS image sensors, RF, mixed-signal, SOCs, LEDs, CPUs, analog, power ICs, and others.
The packaging segment is sub-segmented into 2D, 2.5D, and 3D packaging technology. The water bumping procedure segment is sub-segmented into lead-free, gold stud platter solders, copper pillar tin-lead eutectic solders, and others.
The packaging type segment is sub-segmented into flip-chip pin grid array (FC PGA), flip-chip quad flat no-lead (FC QFN), flip chip-chip-scale package (FC CSP), flip-chip ball grid array (FC BGA), flip-chip land grid array (FC LGA), flip-chip system-in-package (FC SIP), and others.
The application segment is bifurcated into military, industrial, automotive, consumer electronics, telecommunications, medical devices, aerospace, and others. The region segment is bifurcated into North America, Europe, Asia-Pacific, the Middle East & Africa, and others.
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Global Flip Chip Technology Market –Regional Analysis
The Asia Pacific region dominates the global Flip Chip Technology market. The presence of a large number of flip-chip manufacturing companies and the high investments by major players in the development and research activities boosts the market size. The region has long been attracting foreign investors with its raw material advantage and the availability of cost-competitive workforces.
Besides, the growing demand for technologically advanced consumer electronics and telecom & medical devices substantiate the market revenues. Countries like Japan, South Korea, China, and India account for leading markets for flip-chip technologies in the region.
Major Players
Players leading the Flip Chip Technology market include Intel Corporation (US), Samsung Group (South Korea), Global Foundries (US), ASE, Inc. (Taiwan), UMC (Taiwan), Amkor Technology (US), Powertech Technology (Taiwan), STATS ChipPAC (Singapore), Texas Instruments (US), and STMicroelectronics (Switzerland), among others.
Industry/ Innovation/Related News
Nov. 02, 2021 — POET Technologies, a design and development company offering integrated solutions, announced its collaboration with CW laser, a leading global supplier of lasers, to enhance its optical interposer platform capabilities. These partners would work together to design and produce flip-chippable Continuous Wave (CW) high power lasers for use in the Company’s 400G Optical Engines. In the next phase, CW would build and supply advanced lasers for POET use to produce 400G Optical Engines.
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Strategic Points Covered in Table of Content of Global Flip Chip Technology Market:
1. Introduction
2. Market Segmentation
3. Market Overview
4. Executive Summary
5. Premium Insights
6. By Component
7. Product Type
8. Delivery
9. Industry Type
10. Geography
11. Company Landscape
12. Company Profiles
13. Related Reports
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Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down.
The connection is made through conductive bumps placed on the surface of the die.
Die is picked up and place on a “flipping device”2.
Die is “flipped” and moved to hover over the substrate (or board or carrier) where bumps reside-precisely positioned in their previously defined positions3.
The tool then places the die on the bump with a programmed amount of forceAccording to this study, over the next five years the Flip Chip Bonder market will register a 13.1% CAGR in terms of revenue, the global market size will reach US$ 510 million by 2024, from US$ 250 million in 2019.
In particular, this report presents the global market share (sales and revenue) of key companies in Flip Chip Bonder business, shared in Chapter 3.Download FREE Sample of this Report @ https://www.grandresearchstore.com/report-sample/global-flip-chip-bonder-2019-2024-649This report presents a comprehensive overview, market shares, and growth opportunities of Flip Chip Bonder market by product type, application, key manufacturers and key regions and countries.This study considers the Flip Chip Bonder value and volume generated from the sales of the following segments:Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.Automatic Flip Chip BonderSemi-Automatic Flip Chip BonderSegmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.IDMsOSATThis report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.AmericasUnited StatesCanadaMexicoBrazilAPACChinaJapanKoreaSoutheast AsiaIndiaAustraliaEuropeGermanyFranceUKThe report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market.The key manufacturers covered in this report: Breakdown data in in Chapter 3.BesiASM Pacific TechnologyShibauraMuehlbauerKulicke & SoffaHamniAMICRA MicrotechnologiesSETIn addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole.
Market Highlights:Flip-chip refers to semiconductors that are mounted with the active side down.
Flip chip assembly offers many advantages.
The small bumps of flip chip interconnection provide short electrical paths, which yield excellent electrical properties with low capacitance, inductance, and resistance.
This results in greatly improved high-frequency performance compared to other interconnection methods such as chip-and-wire.
The electrical connection pads on the chip and substrate surfaces can be laid out as an area array, rather than around the periphery of the chip.
For instance, 75% of new ASIC designs are now in the flip chip format, and this percentage is increasing.Get Sample of Report @ https://www.marketresearchfuture.com/sample_request/5381Existing 2-D integrated circuit (2.0DIC) flip-chip and wafer-level packaging technologies have shown solid growth over the past five years and are used in a number of mainstream applications predominantly in high-end smartphones.
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