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The global Memory Packaging Market Growth Accelerated by Increasing Integration in Electronics Products

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Leena Shedmake
The global Memory Packaging Market Growth Accelerated by Increasing Integration in Electronics Products

Memory packaging is used in the integrated circuit packaging process to shield integrated circuits from environmental stressors and provide electrical connections. It protects memory chips from factors like moisture, dust contamination, and mechanical stress. The increasing integration of memory chips in consumer electronics, automotive, networking devices, and portable equipment is boosting the demand for advanced memory packaging methods that support miniaturization.


The global Memory Packaging Market is estimated to be valued at US$ 28.08 Bn in 2023 and is expected to exhibit a CAGR of 7.3% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.



Market key trends:

 

The increasing integration of memory chips in various electronics products is one of the major key trends driving the growth of the memory packaging market. Manufacturers are continuously developing integrated electronic products with enhanced memory capacities and functionalities. This has boosted the adoption of innovative memory packaging technologies that enable compact memory integration without compromising on performance. Advanced packaging technologies allow producing smaller and thinner memory packages, thereby accommodating more memory space in premium consumer electronics. This is expected to surge the demand for memory packaging solutions during the forecast period.


Segment Analysis


The global memory packaging market is dominated by the Flip Chip Ball Grid Array (FCBGA) segment which accounted for over 30% share of the total market in 2023. FCBGA packaging type allows mounting of memory chips directly on PCBs or substrates providing superior performance due to short interconnection lengths and low inductance. This also enables very high pin count and small footprint making FCBGA ideal for applications requiring high density and performance such as graphics cards, networking devices and servers.



Key Takeaways


The Global Memory Packaging Market Demand is expected to witness high growth over the forecast period of 2023 to 2030. Regional analysis shows that Asia Pacific region dominates the global market with over 45% share. The region is expected to continue its dominance over the forecast period owing to growing electronics production in countries like China, South Korea and Taiwan. The memory packaging demand is driven by strong electronics sales in the region driven by high disposable incomes and rapid adoption of technologically advanced devices.


Key players operating in the Memory Packaging market are Tianshui Huatian Technology Co Ltd, Hana Micron Inc., lingsen precision industries Ltd, Formosa Advanced Technologies Co. Ltd (FATC), Advanced Semiconductor Engineering Inc. (ASE Inc.), Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd, Powertech Technology, King Yuan Electronics Corp. Ltd, ChipMOS Technologies Inc., TongFu Microelectronics Co., and Signetics Corporation.


Regional analysis shows that North America and Europe are other major regions accounting for around 30% share of global Memory Packaging market. In North America, United States dominates owing to presence of many technology leaders focusing on R&D and deployment of memory chips in applications like servers, datacenters, AI/ML and automotive electronics. Growth in Europe is majorly driven by Germany, United Kingdom and Nordic nations.

 

Explorer more information on this topic, Please visit-

https://www.marketwebjournal.com/memory-packaging-market-growth-and-trnds-analysis-share-size-demand-forecast/

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