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The Global 3D Ics Market Growth Accelerated By Increase In Application Segments

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Dhanesha Patil
The Global 3D Ics Market Growth Accelerated By Increase In Application Segments

3D ICs or three-dimensional integrated circuits are integrated circuits formed by stacking silicon wafers or dies and interconnecting them vertically using through-silicon vias or micro-bumps. 3D ICs help reduce interconnect length and offers improvements in performance and power efficiency. 3D ICs are increasingly being used in advanced application segments such as smartphones, AI data centers, and high-performance computing.

The global 3D ICs Market is estimated to be valued at US$ 16937.26 Mn in 2023 and is expected to exhibit a CAGR of 12% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.


Market key trends:

The increasing use of 3D ICs across various application areas such as smartphones, AI data centers, and high-performance computing is expected to drive the market growth over the forecast period. 3D ICs allow stacking of multiple dies to reduce form factor and interconnect delays, thereby enabling integration of diverse logic and memory configurations needed for such sophisticated applications. The requirement of intensive computing power and higher throughput is fueling demand for 3D IC technology.


Segment Analysis

In the global 3D ICs market, the Through Silicon Via (TSV) based interconnection segment currently dominates and is expected to retain its dominance over the forecast period. This is because TSVs offer significant benefits such as reduced wire length and increased number of connections between stacked silicon components. These help improve chip performance while reducing power consumption.


Key Takeaways


The Global 3D Ics Market Demand is expected to witness high over the forecast period of 2023 to 2030. The market size for 2023 is projected to reach US$ 16937.26 Mn, indicating huge potential in this space.


Regional analysis

Asia Pacific is currently the fastest growing as well as the largest regional market for 3D ICs. Countries like China, Japan, South Korea and Taiwan are major contributors to the region's leading position. This can be attributed to the presence of numerous semiconductor manufacturers and electronic product OEMs in these countries. Furthermore, growing demand for consumer electronics is also propelling market growth.


Key players

Key players operating in the 3D ICs market are Aquahydrex, Inc., MAN Energy Solutions, Electrochaea GmbH, ITM Power PLC, EXYTRON GmbH, Hydrogenics Corporation, Hitachi Zosen Corporation. These players are focusing on new product launches and strategic collaborations to gain competitive advantage.


Get more insights on this topic: https://www.trendingwebwire.com/3d-ics-market-size-and-share-analysis-growth-trends-and-forecasts/


Explore more information on this topic, Please visit: https://wotpost.com/optical-transceivers-enabling-high-speed-data-transmission/


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Dhanesha Patil
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