3D integration that stacks several layers of integrated circuits (ICs) vertically is gaining prominence. 3D ICs will revolutionize the landscape and applications of semiconductor technology in the coming years.
What are 3D ICs?
A 3D integrated circuit, also known as 3D chip, is a advanced packaging technology in which multiple silicon wafers or dies are vertically stacked and interconnected using Through-Silicon Vias (TSVs). This packaging method allows integration of more transistors and components in a smaller footprint compared to planar or 2D chips.
In 3D ICs, active components such as transistors are fabricated on the front-end of several silicon wafers or dies. These wafers or dies are then stacked vertically using microbumps. These bumps electrically and mechanically interconnect the stacked layers using TSVs that pass through the wafer. This multilayer structure eliminates the need for longer interconnect routing typically found in tradition planer chips, thus reducing power consumption, increasing bandwidth and allowing more functionality to be integrated on a single chip.
Benefits of 3D Integration
- Smaller Footprint: 3D ICs utilizes the z-axis or third dimension which allows stacking multiple active layers vertically. This makes the chip footprint much smaller compared to standard planar ICs of similar functionality and component density.
- Higher Performance: The vertical and shorter interconnects provided by 3D structure reduces signal delays and increases speed significantly. It also boosts bandwidth between stacked layers.
- Increased Functionality: Stacking multiple layers help integrate disparate technologies such as memory, processors, analog/RF circuits and MEMS on a single 3D chip. This provides an all-in-one package for mobile, automotive and IoT applications.
- Power Efficiency: Short interconnect routing helps lower power consumption substantially compared to 2D designs with long, global wires spanning the chip area.
- Heterogeneous Integration: 3D integration enables the combining of different fabrication technologies like CMOS, BiCMOS and novel emerging devices in a single package.
Applications and Future Outlook
3D ICs are ideal for applications requiring high performance, small size and low power usage. Major tech companies are currently investigating and developing 3D chips for various applications such as:-
Mobile Devices
3D-IC stacks containing DRAM over logic are promising for mobile SoCs offering high speed memory interfaces. Smartphones from Samsung and Huawei already use 3D DRAM packages to enhance memory bandwidth in flagship phones. Forward-looking projections see 3D NAND memory stacks in mobile by early 2020s.
Automotive Electronics
Advance driver-assistance systems (ADAS) and autonomous driving features will drive the need for high density, reliable and cost-effective computing solutions. Here 3D chips with stacked image sensors, processors and memory will deliver the AI and processing horsepower within the stringent power and thermal budgets of vehicles.
High Performance Computing
Exascale supercomputing requires innovative 3D heterogeneous integration strategies stacking DRAM, non-volatile memories, graphics processors and CPUs. 3D integration provides a compelling path to integrate and interconnect different components densely while keeping power and cost manageable for exascale and beyond applications.
Sensor Fusion
Future IoT, wearables and augmented reality devices demand tightly coupled sensor fusion in small form factors. 3D stacks containing MEMS, imaging and signal processing circuitry will deliver sensor arrays with better performance at lower power.
With ongoing development in 3D manufacturing technologies and design tools, the global 3D IC market is estimated to rise from $2.7 billion in 2018 to over $8 billion by 2023 according to analysts. 3D integration provides a viable solution to continue Moore’s law and fuel innovation across diverse high-tech industries. It will spearhead the evolution of next-generation systems-on-chip and revolutionize semiconductor packaging as we advance into an era of fully 3D heterogeneous integration.
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