Global Chip on Flex Market, By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) - Forecast 2021
Chip On Flex Market is expected to grow at CAGR of ~4.43% during the forecast period and expected to reach market size of US ~$1795 Million by the end of forecast period. Chip On Flex is also known as direct chip attachment. Chip On Flex possess high bending strength, which makes it useful in processes that require bending and folding. It is also used in electronic equipment which requires repeated movements such as printers.
The other advantages provided by Chip On Flex technology include savings in space, mechanical flexibility, low production cost and increased reliability from heat distribution. The market is majorly driven by growing range of applications in the industrial, military, computer, telecommunication, consumer electronics, and medical electronics industries. The increasing collaboration between printed circuit board companies and funding by government bodies also ensures the prevalence of flexible printed circuit board in consumer electronics, automotive, aerospace, defense, Medical as well as other applications.
Unlike rigid boards, flex circuits are not restricted to two dimensions. Because they are as flexible as wires or ribbon cables, flex circuit design options are endless. Flex circuits can be designed to meet highly complex and unimaginable configurations while being able to operate in the most hostile environments. Flexible Circuits are third dimension and can interconnect between two or more planes during execution. With the increasing footprints of wearable’s in the medical device space the two dimensional circuits are getting replaced by the flexible circuit boards acts as an opportunity for the growth of flexible printed boards during the forecasted period.
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Chip On Flex Market
The Global Chip On Flex Market has been segmented on the basis of types, applications and verticals. The types of Chip On Flex are one sided Chip On Flex and others. The applications comprises of static and dynamic flexing. The various verticals of Chip On Flex market are military, medical, aerospace, electronics and others.
Key Players:
The prominent players in the Chip On Flex market are- LGIT corporation (U.S.), Stemko Group (Korea), Flexceed (Japan), Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond Technology Co. Ltd.(China), AKM Industrial Company Ltd.(China), Compass Technology Company Limited (Hong Kong), Compunetics Inc. (U.S.) and Stars Microelectronics Company Ltd (Thailand) and among others.
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Chip On Flex Market report added by Value Market Research, offering growth, trends, and forecast for each segment along with regional and country analysis.
Further, this report also highlights the regional and country-level market analysis.The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide.
The major players in the chip on flex market include AKM INDUSTRIAL COMPANY LIMITED, Chipbond Technology Corporation, Compass Technology Company Limited, Compunetics, Inc., FLEXCEED Co., Ltd., LG INNOTEK, Shenzhen Danbang Technology Co., Ltd., Stars Microelectronics (Thailand) PCL., and other.
This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.Get more information on "Global Chip On Flex Market Research Report" by requesting FREE Sample Copy at https://www.valuemarketresearch.com/contact/chip-on-flex-market/download-sampleMarket DynamicsThe market is mainly driven by rising investment in R to create an advanced flexible display in the market.
Further, the growing demand for small and flexible electronics critical to many devices such as displays, sensors, lighting, biomedical implants, and radio frequency identification, which require automated manufacture with highly accurate performance, is expected to drive the growth of the market.
Moreover, with the use of these chips, industries ensure increased accuracy with reduced error cost and improved product quality with testing repeatability.
Chip on flex has some important features such as heat sinks, component assembly, penalization, shielding, over molding and graphic overlay among others which makes it more acceptable among end users such as electronic industry, aerospace, defense and others.
The major drivers for the growth of this market are increasing need for small and flexible electronics in various applications such as displays, sensors, lighting, biomedical implants, and radio frequency identification among others and the rapid technological advancements which lead to accurate designs and automated production, of flex circuits that helps to eliminate human errors once involved in hand-built wire harnesses.
With the use of these flexible circuit board companies ensure the 100% efficiency in the products, due to which level of fault ratio is drastically reduced.
Chip on flex helps in reducing the cost, improving operator ergonomics, amplified product quality and testing repeatability.The Global Chip on Flex Market is expected to grow from US ~$1437 Million in 2016 to US~$ 1795 Million by 2021, at an estimated CAGR of 4.43%.
The growth of this market can be constrained by the increased cost of raw materials in related industries like the electronic industry along with the wide variety of technology used and the consumer needs changing to efficient, cheaper and powerful consumer electronics and mobile technologies.Key Players The prominent players in the market of chip on flex market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.Get Sample of Report @ https://www.marketresearchfuture.com/sample_request/2015Segments:The Global chip on flex Market has been segmented on the basis of types, applications and verticals.
The various verticals of chip on flex market are military, medical, aerospace, electronics and others.Key Finding:The Global Chip on Flex Market is expected to reach USD 1795 million by 2021.Europe accounts for the largest market share and is growing with a market share of USD 494 million during forecast period.China accounts highest production capacity in the year 2016Global Chip on flex is segmented by type that includes single sided COF and Others.
Chip On Flex MarketChip on flex is popular by its abbreviation COF in the electrical industry.
In the past few years, the electrical sector has underwent a whole lot of changes.
Resultantly, the global chip on flex market is has gained traction.For the uninitiated a chip on flex is a semiconductor which forms an integral part of a flexible circuit.
This is one of the major reasons why most of the enterprise owners are turning towards these semiconductors.Market SynopsisCurrently, the electrical sector is in the stage of technological reformation.
Owing to this fact, it can be positively concluded that the future seems pretty bright for the chip on flex market.
The requirement for smaller and compact flexible electronic systems for various devices like radio frequency, displays, biomedical implants, sensors and lighting happens to be a chief growth factor for the market.In addition to these, recent technological innovations that have brought about improvements like much more accurate designs and automated production can be termed as a secondary growth driver for the industry.Although, the market may face certain obstacles like expensiveness of raw materials and changing requirements of the customers.
Chip-On-Flex MarketChip on flex is popular by its abbreviation COF in the electrical industry.
In the past few years, the electrical sector has underwent a whole lot of changes.
Lately, majority of the electrical businesses out there have started utilizing it.
Resultantly, the global chip on flex market is has gained traction.For the uninitiated a chip on flex is a semiconductor which forms an integral part of a flexible circuit.
This is one of the major reasons why most of the enterprise owners are turning towards these semiconductors.Market SynopsisCurrently, the electrical sector is in the stage of technological reformation.
Owing to this fact, it can be positively concluded that the future seems pretty bright for the chip on flex market.
This report studies the global Chip-On-Flex market status and forecast, categorizes the global Chip-On-Flex market size (value & volume) by manufacturers, type, application, and region.
This report focuses on the top manufacturers in United States, Europe, China, Japan, South Korea and Taiwan and other regions.
Download Free Sample Report @ https://www.radiantinsights.com/research/global-chip-on-flex-market-research-report-2018/request-sample The major manufacturers covered in this report • Stemko Group• Chipbond Technology Corporation• Danbond Technology Co• Compass Technology Company Limited• Stars Microelectronics Public Company Ltd• LGIT Corporation• Flexceed• CWE• AKM Industrial Company Ltd• Compunetics Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering• North America• Europe• China• Japan• Southeast Asia• India Browse Full Research Report with TOC @ https://www.radiantinsights.com/research/global-chip-on-flex-market-research-report-2018 We can also provide the customized separate regional or country-level reports, for the following regions:• North America• United States• Canada• Mexico• Asia-Pacific• China• India• Japan• South Korea• Australia• Indonesia• Singapore• Rest of Asia-Pacific• Europe• Germany• France• UK• Italy• Spain• Russia• Rest of Europe• Central & South America• Brazil• Argentina• Rest of South America• Middle East & Africa• Saudi Arabia• Turkey• Rest of Middle East & Africa On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into• Single Sided Chip on Flex• Other TypesOn the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including• Medical• Electronics• Military• Others The study objectives of this report are:• To analyze and study the global Chip-On-Flex capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);• Focuses on the key Chip-On-Flex manufacturers, to study the capacity, production, value, market share and development plans in future.• Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.• To define, describe and forecast the market by type, application and region.• To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.• To identify significant trends and factors driving or inhibiting the market growth.• To analyze the opportunities in the market for stakeholders by identifying the high growth segments.• To strategically analyze each submarket with respect to individual growth trend and their contribution to the market• To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market• To strategically profile the key players and comprehensively analyze their growth strategies.
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